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  +603-76136915   P1-30 Lumi Tropicana, Persiaran Tropicana, 47800

Micro Solder Ball Repair Equipment

High-speed Micro Solder ball inspection and repair for high-density mounting printed circuit boards and wafers.
Detects non-ball mounted, mounting position shift, ball cluster, surplus ball, different diameter ball, Contamination, and performs high-speed repair

Bump formation process for package devices, FOWLP, etc.

Corresponding ball size: φ40μm – φ500μm
Available board size PCB 500mmx500mm

Silicon wafer: 12inch
Inspection and defect correction items


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