Micro Solder Ball Repair Equipment

[Overview]
High-speed Micro Solder ball inspection and repair for high-density mounting printed circuit boards and wafers.
Detects non-ball mounted, mounting position shift, ball cluster, surplus ball, different diameter ball, Contamination, and performs high-speed repair

[Use]
Bump formation process for package devices, FOWLP, etc.

[Specification]
Corresponding ball size: φ40μm – φ500μm
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Available board size PCB 500mmx500mm

Silicon wafer: 12inch
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Inspection and defect correction items