[Overview]
After mass transfer of MINI / μ-LED, this machine perform chip inspection, chip removal and chip remounting.

[Use]
Equipment to modify the display for the completion of MINI / μ-LED devices
for large displays

[Specification]
Inspection process: LED Chip inspection
Chip Yes / No
Chip misalignment
Chip dirt
Particle
PL (photoluminescence)
Chip removal: Laser irradiation melts and removes solder
Chip remount: Micro LED 15×25μ~100μ, Mini LED 100μ～1000μm